Platform |
CPU | Dual Intel 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake-SP) with C621/C627 PCH
| Memory | 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
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I/O |
LAN | 100G(KR4) x2 to top 1st layer switch blade 100G(KR4) x2 to top 2nd layer switch blade Intel Ethernet 800 Series Intel I210 1GbE x2
| Rear I/O | 1x miniDP (VGA signal) 1x RJ45 management port on rear side 1x USB 2.0
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OS and Certifications |
Certifications | CE Class A FCC Class A
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Physical and Environmental |
Storage temperature | -40~70ºC
| Operating temperature | 0 ~ 40ºC
| Humidity | 5%~90%. non-condensing
| Dimensions (W x H x D) | 327.4 x 41 x 466 mm
| Weight | 8 kg
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Features |
Interface | 1x M.2 2280 M Key Socket (SATA3/PCIe x4) 1x OPMA connector 1x PCI-Express Gen 2 (To front side module) 1x pin header for TPM 2.0 module (Optional) 5x PCI-Express Gen3 by 8 (To front side module)
| Compatible models | HTCA-6200, HTCA-6400 and HTCA-6600
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ORDERING INFORMATION - Different Versions |
HMB-6110A | Skylake-SP/Cascade Lake-SP x2 sockets, DDR4 sockets x16 with tray, C627 (with QAT)
| HMB-6110B | Skylake-SP/Cascade Lake-SP x2 sockets, DDR4 sockets x16 with tray, C621 (without QAT)
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