Platform |
CPU | Intel®2nd Gen Xeon Scalable processor Ex. Intel Xeon Gold 5217 8C/16T,3.0GHz
| Chipset | lntel® C622 PCH
| Memory | 6 x DDR4-2933 RDIMM (up to 384GB)
| Watchdog Timer | 1~255 sec. software programmable(0=Disable)
| Ethernet | 1 x GbE RJ-45 Management port 2 x 10GbE SFP+ (Intel XL710) 2 x GbE RJ-45 (intel i210-iT)
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Storage |
SATA | 4 x SATA III port (RAID 0/1/5/10)
| Disk Bay | 4 x 2.5" Hot swappable SSD bay (All in one)
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I/O |
USB | 12 x USB 3.2 Gen1(5Gbps)
| Exp. PCIe slot | 3 x Exp. PCIe Gen3 x16 slot (GPU Card)
| Mini PCIe | 1 x M.2 socket (for 4G) 1 x Mini PCIe socket (for WiFi)
| GPIO | GPIO 4-in / 4-out
| Serial Port | 4 X COM – DB9 (RS232/RS422/485)
| Audio | 3 x Audio jack ● Green: Audio out ● Blue: Remote switch ● Pink : Mic in
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Power and Mechanical |
Power input | DC 18~36V, 1300W PSU, or DC 36~72V, 1900W PSU
| Management | IPMI 2.0 (ASPEED AST2500 BMC)
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OS and Certifications |
Certifications | CE / FCC class B / E Mark / cULus / RoHS
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Physical and Environmental |
Storage temperature | -40~80°C (-40~176°F)
| Operating temperature | -25 ~ 45°C (-13~113°F)with 3 x 250W GPU cards installed & 100% CPU/GPU loading -25 ~ 50°C (-13~122°F)with 2 x 250W GPU cards installed & 100% CPU/GPU loading.
| Security | TPM 2.0 (Infineon chipset)
| Thermal Design | IEC 60068-2-64, 5~500Hz, 3GRMS(SSD)
| Chassis | Aluminum extrusion heat sink & metal chassis
| Shock | IEC 60068-2-27, 50G 500m/s2 11MS
| Vibration | IEC 60068-2-64, 5~500Hz, 3GRMS(CF/SSD)
| Dimensions | 400 (W) x 190 (H) x 510 (D) mm
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Expansion |
SIM Card slot | 1 x SIM card Socket
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Video |
Video Interface | 1 x VGA
| Video Memory | Integrated
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Software |
OS Support | Windows 10 (64 bit) / Linux kernel to 4.4 or above(64 bit)
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More |
CAN Bus | CAN Bus 2.0B OBD II (Option)
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